POWER Supply on Chip (PowerSoC) with Integrated Passives

The PowerSwipe project addresses a key roadblock for PowerSoC by, for the first time, miniaturising and integrating state-of-the-art, high density trench capacitor substrate technology with novel thin film magnetics on silicon to deliver a multi-component LC (inductor-capacitor) interposer which will be combined, in a 3D heterogeneous stack, using eWLB technology, with the ╬╝Controller chip.

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